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  SMBT3904S nov-30-2001 1 npn silicon switching transistor array  high dc current gain: 0.1ma to 100ma  low collector-emitter saturation voltage  two ( galvanic) internal isolated transistors with good matching in one package  complementary type: smbt3906s (pnp) vps05604 6 3 1 5 4 2 eha07178 6 54 3 2 1 c1 b2 e2 c2 b1 e1 tr1 tr2 type marking pin configuration package SMBT3904S s1a 1=e1 2=b1 3=c2 4=e2 5=b2 6=c1 sot363 maximum ratings unit parameter symbol value collector-emitter voltage v ceo v 40 60 collector-base voltage v cbo emitter-base voltage 6 v ebo dc collector current i c ma 200 250 mw total power dissipation , t s = 115 c p tot c t j junction temperature 150 storage temperature t st g -65 ... 150 thermal resistance junction - soldering point 1) r thjs  140 k/w 1 for calculation of r thja please refer to application note thermal resistance
SMBT3904S nov-30-2001 2 electrical characteristics at t a =25c, unless otherwise specified. parameter symbol values unit min. typ. max. dc characteristics collector-emitter breakdown voltage i c = 1 ma, i b = 0 v (br)ceo 40 - - v collector-base breakdown voltage i c = 10 a, i e = 0 v (br)cbo 60 - - emitter-base breakdown voltage i e = 10 a, i c = 0 v (br)ebo 6 - - collector cutoff current v cb = 30 v, i e = 0 i cbo - - 50 na dc current gain 1) i c = 100 a, v ce = 1 v i c = 1 ma, v ce = 1 v i c = 10 ma, v ce = 1 v i c = 50 ma, v ce = 1 v i c = 100 ma, v ce = 1 v h fe 40 70 100 60 30 - - - - - - - 300 - - - collector-emitter saturation voltage1) i c = 10 ma, i b = 1 ma i c = 50 ma, i b = 5 ma v cesat - - - - 0.2 0.3 v base-emitter saturation voltage 1) i c = 10 ma, i b = 1 ma i c = 50 ma, i b = 5 ma v besat 0.65 - - - 0.85 0.95 1) pulse test: t < 300  s; d < 2%
SMBT3904S nov-30-2001 3 electrical characteristics at t a = 25c, unless otherwise specified. parameter values symbol unit max. typ. min. ac characteristics f t 300 - mhz - transition frequency i c = 10 ma, v ce = 20 v, f = 100 mhz c cb - - collector-base capacitance v cb = 5 v, f = 1 mhz pf 4 c eb - - 8 emitter-base capacitance v eb = 0.5 v, f = 1 mhz h 11e 1 10 - short-circuit input impedance i c = 1 ma, v ce = 10 v, f = 1 khz k  h 12e 0.5 8 10 -4 - open-circuit reverse voltage transf.ratio i c = 1 ma, v ce = 10 v, f = 1 khz h 21e 100 - short-circuit forward current transf.ratio i c = 1 ma, v ce = 10 v, f = 1 khz - 400 h 22e 1 - 40  s open-circuit output admittance i c = 1 ma, v ce = 10 v, f = 1 khz noise figure i c = 100 a, v ce = 5 v, r s = 1 k  , f = 1 khz,  f = 200 hz f - - 5 db delay time v cc = 3 v, i c = 10 ma, i b1 = 1 ma, v be(off) = 0.5 v t d - - 35 ns rise time v cc = 3 v, i c = 10 ma, i b1 = 1 ma, v be(off) = 0.5 v t r - - 35 storage time v cc = 3 v, i c = 10 ma, i b1 = i b2 = 1ma t stg - - 200 fall time v cc = 3 v, i c = 10 ma, i b1 = i b2 = 1ma t f - - 50
SMBT3904S nov-30-2001 4 test circuit delay and rise time ehn00061 275 10 k +3.0 v 0 -0.5 v <4.0 pf c +10.9 v d = 2% 300 ns <1.0 ns ? ? storage time and fall time ehn00062 275 10 +3.0 v 0 -9.1 <4.0 pf c +10.9 v d = 2% 1n916 <1.0 t 1 s 500 10 t 1 ? ? v k ns <<
SMBT3904S nov-30-2001 5 total power dissipation p tot = f ( t s ) 0 20 40 60 80 100 120 c 150 t s 0 50 100 150 200 mw 300 p tot permissible pulse load r thjs = f ( t p ) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs 0.5 0.2 0.1 0.05 0.02 0.01 0.005 d = 0 permissible pulse load p totmax / p totdc = f ( t p ) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 3 10 - p totmax / p totdc d = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
SMBT3904S nov-30-2001 6 saturation voltage i c = f ( v besat , v cesat ) h fe = 10 ehp00756 2 0 v be sat c 10 1 10 0 5 v ma 0.2 0.4 0.6 0.8 1.0 1.2 ce sat v , 5 10 2 v be v ce dc current gain h fe = f ( i c ) v ce = 10v, normalized ehp00765 10 10 ma h c 5 fe 10 1 0 10 -1 5 10 10 10 -1 0 1 2 125 c 25 c -55 c 55 2 short-circuit forward current transfer ratio h 21e = f ( i c ) v ce = 10v, f = 1mhz ehp00759 10 10 ma h c 5 21e 10 3 2 10 1 5 10 10 -1 0 1 5 open-circuit output admittance h 22e = f ( i c ) v ce = 10v, f = 1mhz ehp00760 10 10 ma h c 5 22e 10 2 1 10 0 5 10 10 -1 0 1 5 s
SMBT3904S nov-30-2001 7 storage time t stg = f ( i c ) ehp00762 10 ma t c s 10 1 10 0 10 10 01 2 55 ns 3 10 10 2 10 3 h fe = 20 10 25 c 125 c 10 = 20 fe h delay time t d = f ( i c ) rise time t r = f ( i c ) ehp00761 10 ma t c r 10 1 10 0 10 10 01 2 55 ns r t t d , 3 10 d t 10 2 10 3 = 3 v cc v 0 v v = 2 v be 40 v 15 v h fe = 10 fall time t f = f ( i c ) ehp00763 10 ma t c f 10 1 10 0 10 10 01 2 55 ns 3 10 10 2 10 3 h fe = 20 25 c 125 c cc v = 40 v = 10 fe h rise time t r = f ( i c ) ehp00764 10 ma t c r 10 1 10 0 10 10 01 2 55 ns 3 10 10 2 10 3 25 c 125 c cc v = 40 v = 10 fe h
SMBT3904S nov-30-2001 8 input impedance h 11e = f ( i c ) v ce = 10v, f = 1khz 10 ehp00757 -1 1 10 ma -1 10 2 10 5 5 10 0 10 0 c 11e h 1 10 5 ? k open-circuit reverse voltage transfer ratio h 12e = f ( i c ) v ce = 10v, f = 1khz ehp00758 10 ma h c 12e 10 -5 5 10 10 -1 0 1 5 10 -4 10 -3
published by infineon technologies ag, st.-martin-strasse 53, 81669 mnchen ? infineon technologies ag 200 4 . all rights reserved. attention please! the information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. terms of delivery and rights to technical change reserved. we hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office (www.infineon.com). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.


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